DOW™ High Performance Underlayment (HPU) Layflat Insulation is an extruded polystyrene foam insulation board fanfolded into 50' lengths for easy installation over old siding as a rigid foam underlayment for new siding materials. It also features a special slit hinge that allows the board to lay flat on the wall.
DOW™ HPU Layflat Insulation is heat-bonded between various facers and then pin-perforated for vapor permeance.
Building Code Compliance
Meets IBC/IRC requirements for foam plastic insulation. See ESR-2142, BOCA-ES RR 21-02, ICBO-ES ER-2257. UL Fire Classified. Std. Reg. # CA T064. Florida Building Code FL 3835.
Dow Residing Quick Guide (380KB PDF)
Fanfolded DOW™ HPU Layflat Insulation is specially designed to provide economical insulation, underlayment and a solid, level surface for new siding materials. It also has special slit hinges that allow the board to lay flat on the wall.
|Facers Available for DOW™ HPU Layflat Insulation|
|Plastic/Plastic (P/P)||Bonds the insulation between strong plastic film facers. Available in 1/4" and 3/8" thickness.|
|Plastic/Reflective (P/R)||Bonds the insulation between a strong plastic film facer and a metallic, reflective plastic film facer. Available in 1/4" and 3/8" thickness.|
|Nominal Board Thickness(1), in||R-Value(2)||Board Size, ft||Edge Treatment||Min Compressive Strength(3), psi|
|.25||1.0||4 x 50||Square Edge||15|
|.375||1.5||4 x 50||Square Edge||15|
(1)Not all product sizes are available in all regions.
(2) R means resistance to heat flow. The higher the R-value, the greater the insulating power. R-values are expressed in ft2 • h•°F/Btu. RSI values are expressed in m2 °C/W. R-value determined by ASTM C518.
(3) Vertical compressive strength is measured at 10% deformation or at yield, whichever occurs first.
07 20 00 – Board Insulation
For additional information regarding DOW™ Protection Board III visit http://www.adamsplasticsinc.com/.
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