MOR-AD laminating adhesive

MOR-AD™ Laminating Adhesive

MOR-AD™ Series is a moisture cure, one-part non-sag urethane laminate adhesive.

For Use With:

  • Structural insulated panel (SIP) adhesion
  • Other panel laminations
  • High volume building and construction panel applications

Advantages

  • Solvent –free liquid
  • Good flow and transfer properties
  • Strong bonds to a wide variety of materials
  • Excellent resistance to heat, cold and moisture.

Product Information Sheets